Specification:Diamond height 12MM
Diameter 4.5″/115MM, Bore 22.23MM/7/8″,Segment thickness 2.3MM
Application:
Hard material, reinforced concrete, hard granite, hard brick ect.
Feature:
Dry cutting, Laser welding provide best welding strength avoid segment-off.
New Technology in diamond array, its 3D distribution guarantees sufficient use of each diamond particle
More efficient, fast and stable in cutting
12MM segment height provide much longer life
